We currently serve the electronic, connector, and semiconductor sectors as well as many areas of commercial, military and aerospace manufacturing.
For intricate shapes, including molded contacts, connectors, rotatable connectors, ground springs, and selective plating.
For high volume mid-size parts, selective plating, intricate geometries.
For high volume of contact pins, small contact rings, and various small size parts.
Featuring the latest in X-ray per ASTM B 568, Chemical Analysis and Atomic Absorption, NDT, Solderability, Adhesion per ASTM B 571.
Parts up to 2 feet.
*12% env fee applicable on all orders.
*Notice is hereby given that Sheffield Platers Terms and Conditions of sale, QP4.3F06 Rev D shall apply to this order and can be found here: Terms & Conditions
*Equivalent to Mil – T – 10727 Type I, Matte or Bright surface appearance, Pure tin and tin-lead coatings available.
Class A THICKNESS: .00010” min DETAIL: Mild Service Condition
Class B THICKNESS: .00020” min DETAIL: Precoat for solder or surface prep for painting.
Class C THICKNESS: .00032”-.00040” min DETAIL: Varies by substrate, Moderate service conditions.
Class D THICKNESS: .00060”-.00080” min DETAIL: Varies by substrate. Severe service conditions.
Class E THICKNESS: .0012” min DETAIL: Very severe service conditions.
Class F THICKNESS: .000060” min DETAIL: Short–Term contact application
