SILVER PLATING – min lot $125 

Sheffield’s Silver Plating Offers:

  • High electrical conductivity
  • Thermal conductivity
  • High temperature resistance
  • Excellent corrosion resistance (with nickel under-plate)
  • Anti-tarnish resistance options
  • Good solderability
  • Good lubricity
  • Ability to carry high frequency signals
  • Anti-galling

We currently serve the electronic, connector, satellite, microwave, and semiconductor sectors as well as many areas of commercial, military and aerospace manufacturing.

Capabilities & Capacities:

Rack Plating

For intricate shapes, including molded contacts, connectors, rotatable connectors, ground springs, and selective plating.

Wire Plating

For high volume mid-size parts, selective plating, intricate geometries.

Barrel Plating

For high volume of contact pins, small contact rings, and various small size parts.

Extensive In-house Quality and Analytical Laboratory

Featuring the latest in X-ray per ASTM B 568, Chemical Analysis and Atomic Absorption, NDT, Solderability, Adhesion per ASTM B 571.

Capacities

Parts up to 2 feet.


*8% env fee applicable on all orders.

*Notice is hereby given that Sheffield Platers Terms and Conditions of sale, QP4.3F06 Rev D shall apply to this order and can be found here: Terms & Conditions

Specifications:

PROCESS: Silver
SPECIFICATIONS:

 

QQ-S-365
*Nickel/Copper underplate required for ferrous substrates

Type I THICKNESS: .0005” min DETAIL: Matte finish
Type II THICKNESS: .0005” min DETAIL: Semi-bright finish
Type III THICKNESS: .0005” min DETAIL: Bright finish
Grade A DETAIL: Tarnish resistant supplementary treatment
Grade B DETAIL: No supplementary treatment

ASTM B 700
Type I DETAIL: 99.9% min. purity
Type II DETAIL: 99.0% min purity
Type III DETAIL: 98.0% min purity
Grade A DETAIL: Matte finish
Grade B DETAIL: Bright finish
Grade C DETAIL: Bright finish (polished)
Grade C DETAIL: Semibright finish

 

*Nadcap and RoHs Compliant

For More Silver Plating Information:

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