GOLD PLATING – min lot $175

Sheffield’s Gold Plating Services:

Sheffield Platers GOLD plating is widely used for engineering applications, predominately for it’s electrical properties and where good corrosion resistance, excellent solderability, or high tarnish resistance is needed. From prototyping and PPAP qualification to full production processing, it is our goal to exceed your quality expectations. We currently serve the electronic, microwave, satellite, medical, and connector, sectors as well as many areas of commercial, military and aerospace manufacturing.

 

We currently serve the electronic, microwave, satellite, medical, and connector sectors as well as many areas of commercial, military and aerospace manufacturing.

Capabilities & Capacities:

Rack Plating

For intricate shapes, including molded contacts, connectors, rotatable connectors, ground springs, and selective plating.

Barrel Plating

For high volume of contact pins, small contact rings, and various small size parts.

Vibratory Plating

For highest quality on contact pins, contact rings, and various small size parts. This method includes best distribution and coverage, including difficult to plate inside wall of small bores.

Extensive In-house Quality and Analytical Laboratory

Featuring the latest in X-ray per ASTM B 568, Chemical Analysis and Atomic Absorption, NDT, Solderability, Adhesion per ASTM B 571.

Reliable Lead times

You can count on Sheffield Platers to be on time every time.

Capacities

Parts up to 2 feet (for type I or II)
Parts up to 1 foot (for type III)


*8% env fee applicable on all orders.

*Notice is hereby given that Sheffield Platers Terms and Conditions of sale, QP4.3F06 Rev D shall apply to this order and can be found here: Terms & Conditions

Specifications:

PROCESS: Gold
SPECIFICATIONS:

Mil – DTL – 45204 / Mil-G-45204
Class 00 THICKNESS: .000020” min
Class 0 THICKNESS: .00003” min
Class 1 THICKNESS: .00005” min
Class 2 THICKNESS: .00010” min
Class 3 THICKNESS: .00020” min
Class 4 THICKNESS: .00030” min
Class 5 THICKNESS: .00050” min
Class 6 THICKNESS: .00150” min
Type I DETAIL: 99.7% pure (SPI provides w/Grade C)
Type II DETAIL: 99.0% pure (SPI provides w/Grade C)
Type III DETAIL: 99.9% pure (SPI provides w/Grade A)
Grade A DETAIL: 90 Knoop hardness max (SPI provides w/Type III)
Grade B DETAIL: 91-129 Knoop hardness (Not provided by SPI)
Grade C DETAIL: 130-200 Knoop hardness (SPI provides w/Type I & II)
Grade D DETAIL: 200 Knoop hardness min (Not provided by SPI)

ASTM B 488

Class 0.25 THICKNESS: 0.25 µm (10 µin) min
Class 0.50 THICKNESS: 0.5 µm (20 µin) min
Class 0.75 THICKNESS: 0.75 µm (30 µin) min
Class 1.0 THICKNESS: 1.0 µm (40 µin) min
Class 1.25 THICKNESS: 1.25 µm (50 µin) min
Class 2.5 THICKNESS: 2.5 µm (100 µin) min
Class 5.0 THICKNESS: 5.0 µm (200 µin) min
Type I DETAIL: 99.7% pure (SPI provides w/Grade C)
Type II DETAIL: 99.0% pure (SPI provides w/Grade C)
Type III DETAIL: 99.9% pure (SPI provides w/Grade A)
Grade A DETAIL: 90 Knoop hardness max (SPI provides w/Type III)
Grade B DETAIL: 91-129 Knoop hardness (Not provided by SPI)
Grade C DETAIL: 130-200 Knoop hardness (SPI provides w/Type I & II)
Grade D DETAIL: 200 Knoop hardness min (Not provided by SPI)

 

*Nadcap and RoHs Compliant

For More Gold Plating Information:

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