TIN PLATING – min lot $175 

Sheffield’s Tin Plating Offers:

  • Bright Tin: 100% pure tin
  • 93% Tin 7% lead (+ or – 5%) for anti-whiskering
  • Anti-galling
  • Corrosion resistance
  • Ductility
  • Low contact resistance
  • Solderability
  • Thermal Conductivity

We currently serve the electronic, connector, and semiconductor sectors as well as many areas of commercial, military and aerospace manufacturing.

Capabilities & Capacities:

Rack Plating

For intricate shapes, including molded contacts, connectors, rotatable connectors, ground springs, and selective plating.

Wire Plating

For high volume mid-size parts, selective plating, intricate geometries.

Barrel Plating

For high volume of contact pins, small contact rings, and various small size parts.

Extensive In-house Quality and Analytical Laboratory

Featuring the latest in X-ray per ASTM B 568, Chemical Analysis and Atomic Absorption, NDT, Solderability, Adhesion per ASTM B 571.

Capacities

Parts up to 2 feet.


*8% env fee applicable on all orders.

*Notice is hereby given that Sheffield Platers Terms and Conditions of sale, QP4.3F06 Rev D shall apply to this order and can be found here: Terms & Conditions

Specifications:

PROCESS: Tin
SPECIFICATIONS: ASTM B 545

*Equivalent to Mil – T – 10727 Type I, Matte or Bright surface appearance, Pure tin and tin-lead coatings available.

Class A THICKNESS: .00010” min DETAIL: Mild Service Condition
Class B THICKNESS: .00020” min DETAIL: Precoat for solder or surface prep for painting.
Class C THICKNESS: .00032”-.00040” min DETAIL: Varies by substrate, Moderate service conditions.
Class D THICKNESS: .00060”-.00080” min DETAIL: Varies by substrate. Severe service conditions.
Class E THICKNESS: .0012” min DETAIL: Very severe service conditions.
Class F THICKNESS: .000060” min DETAIL: Short–Term contact application

For More Tin Plating Information:

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